Why Choose Us
In the field of optical modules, we stand out with our outstanding overall strength, becoming a trusted partner for our customers.
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The driving force behind technological innovation
Core Process Advantage: High-Density Optical/Electrical DB-WB Technology
Wuhan Geling Technology boasts a seasoned R&D team specializing in high-density optical/electrical DB-WB (Die Bonding–Wire Bonding) processes, with over 50% of engineers having more than 20 years of experience. Our proprietary DB-WB technology enables multi-chip high-density integration, enhancing signal integrity while reducing power consumption and costs. The incorporation of metal shielding layers significantly improves electromagnetic interference resistance, outperforming similar products by 30%. This technology is applicable to 400G/800G and higher-speed optical communication products, ensuring high performance and reliability.
Proprietary Multi-Channel Laser Coupling Technology
Our self-developed multi-channel laser coupling technology supports 400G/800G/1.6T high-speed optical modules, encompassing various coupling schemes such as VCSEL+MLA, DFB/EML+FA, and SiPh waveguides. Key features include coupling efficiency exceeding 85%, insertion loss below 1 dB, channel power variation within ±0.5 dB, alignment error under 0.5 μm, and exceptional stability under high-temperature and high-humidity conditions. With an automated alignment rate of over 90% and a yield rate exceeding 95%, this technology is well-suited for large-scale production, ensuring consistent performance and quality.
Independently Developed Parallel Automated Testing Technology
Our proprietary parallel automated testing technology for optical modules allows simultaneous multi-channel testing of multiple modules, significantly enhancing testing efficiency and consistency for 400G/800G/1.6T modules. Core components include parallel bit error rate testing, optical power/spectrum analysis, eye diagram testing, temperature aging testing, and automated test software, supporting modulation formats like PAM4 and NRZ. Future expansions may include 32-channel testing capabilities, integration of AI-driven data analysis, and remote testing functionalities, paving the way for fully automated optical module production lines.
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Optoelectronic Design and Device-Level Simulation
Utilization of internationally leading EDA tools for designing low-power, high-bandwidth, and highly reliable optical modules.
Die Attach Process and Equipment
Sub-micron precision die attach processes ensure high reliability and consistency in optical modules.
Wire Bonding Process and Equipment
High-precision wire bonding guarantees stable high-speed signal transmission and long-term reliability.
Automated Optical Path Coupling Process and Equipment
Sub-micron level optical path coupling ensures low insertion loss and high consistency in optical modules.
Design Verification Process and Equipment
Comprehensive verification systems ensure stable performance and military-grade quality of optical modules.
COB Packaging Process and Equipment
Automated precision COB packaging enhances heat dissipation and cost-effectiveness, supporting compact and efficient 800G/400G optical modules.
Optical Engine Assembly and Module Manufacturing
Automated precision assembly in cleanroom environments, coupled with thermal testing, ensures stable performance of 400G/800G modules.
Fully Automated Testing Equipment and Processes
Comprehensive automated testing systems cover electrical, optical, and environmental parameters, ensuring efficient and consistent military-grade optical modules.
Appearance and Physical Inspection
- 360° Automated Optical Inspection (AOI)
- Surface particle control ≤5μm
- Insertion/removal durability ≥500 cycles
Extreme Environmental Reliability Testing
Commercial-grade: 0°C to +70°C, 500 cycles
Temperature change rate: 30°C/min
Damp heat aging: 2000 hours with performance degradation <5%
Protocol Compatibility Testing
Multi-protocol version compatibility verification
Cross-vendor equipment interoperability testing
Dynamic traffic fault tolerance assessment
Transmission Reliability Verification
228-hour high-temperature accelerated aging
Bit error rate testing using PRBS31 patterns
Jitter tolerance testing compliant with OIF-CEI standards
Mass Production Strength
Class 10,000 cleanroom packaging facilities
Annual production capacity of 3 million units, ensuring rapid delivery
Deep Collaboration Models
Joint Design Manufacturing (JDM)
OEM/ODM services
100% Intellectual Property protection
Testing Architecture Design
Physical Layer Verification: Utilization of BERTScope for NRZ/PAM4 signal integrity testing, ensuring interfaces like SFP+/QSFP28/OSFP comply with IEEE 802.3bm/cd standards, with insertion loss <1.5 dB at 28 GHz.
Protocol Layer Verification: Employing Spirent TestCenter to simulate 128-node network topologies, verifying key functions such as FEC correction, Auto-Negotiation, and Link Training, meeting OpenEye Mask specifications.
Application Layer Verification: Constructing real-world traffic models like RoCEv2/FCoE to validate end-to-end latency <200 ns and zero packet loss rate >99.999%.
Warranty Commitment
36-month extended warranty
Next Business Day (NBD) replacement for failures within the first year
Lifetime maintenance at cost price
Global Service Network
24/7 multilingual technical support
Free optical link diagnostic services
Annual preventive maintenance plans
Equipment compatibility upgrade solutions